Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475745 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2019-11-12 |
| 10373900 | Tin-zinc microbump structures and method of making same | Sri Chaitra Jyotsna Chavali, Kyu Oh Lee | 2019-08-06 |
| 10297563 | Copper seed layer and nickel-tin microbump structures | Rahul Jain, Kyu Oh Lee, Steve Cho | 2019-05-21 |