Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468374 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Ji-Yong Park, Kyu Oh Lee | 2019-11-05 |
| 10373951 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park, Sai Vadlamani +1 more | 2019-08-06 |
| 10297563 | Copper seed layer and nickel-tin microbump structures | Kyu Oh Lee, Amanda E. Schuckman, Steve Cho | 2019-05-21 |