Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475745 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2019-11-12 |
| 10390438 | Integrated circuit package substrate | — | 2019-08-20 |
| 10325843 | Integrated circuit package substrate | Stefanie M. Lotz | 2019-06-18 |