Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10303225 | Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby | Kemal Aygun, Zhichao Zhang, Guneet Kaur | 2019-05-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10303225 | Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby | Kemal Aygun, Zhichao Zhang, Guneet Kaur | 2019-05-28 |