Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325860 | Microelectronic bond pads having integrated spring structures | Feras Eid, Robert L. Sankman | 2019-06-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325860 | Microelectronic bond pads having integrated spring structures | Feras Eid, Robert L. Sankman | 2019-06-18 |