Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522375 | Monitoring system for deposition and method of operation thereof | Edward W. Budiarto, Majeed A. Foad, Ralf Hofmann, Thomas Nowak, Mehdi Vaez-Iravani | 2019-12-31 |
| 10510624 | Metrology systems with multiple derivative modules for substrate stress and deformation measurement | Mehdi Vaez-Iravani, Samer Banna, Kyle Tantiwong | 2019-12-17 |
| 10281261 | In-situ metrology method for thickness measurement during PECVD processes | Khokan Chandra Paul, Edward W. Budiarto, Mehdi Vaez-Iravani, Jeongmin Lee, Dale R. Du Bois +1 more | 2019-05-07 |
| 10260855 | Electroplating tool with feedback of metal thickness distribution and correction | Edward W. Budiarto, Robert O. Miller, Abraham Ravid, Bridger Earl HOERNER, Robert W. Batz, Jr. +1 more | 2019-04-16 |
| 10234261 | Fast and continuous eddy-current metrology of a conductive film | Edward W. Budiarto, Dmitry A. Dzilno, Jeffrey C. Hudgens, Nir Merry | 2019-03-19 |
| 10217650 | Methods and apparatus for substrate edge cleaning | James M. Holden, Song-Moon Suh, Kalyanjit Ghosh, Leon Volfovski, Michael R. Rice +1 more | 2019-02-26 |
| 10196741 | Wafer placement and gap control optimization through in situ feedback | Kevin Griffin, Abraham Ravid, Alex Minkovich, Somesh Khandelwal, Joseph Yudovsky | 2019-02-05 |