Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373864 | Systems and methods for wetting substrates | Paul R. McHugh, Marvin L. Bernt, Thomas H. Oberlitner, Brian Aegerter, Richard W. Plavidal +3 more | 2019-08-06 |
| 10260855 | Electroplating tool with feedback of metal thickness distribution and correction | Todd Egan, Edward W. Budiarto, Robert O. Miller, Abraham Ravid, Robert W. Batz, Jr. +1 more | 2019-04-16 |