| 10163833 |
Multichip modules and methods of fabrication |
Liang Wang, Hong Shen |
2018-12-25 |
| 10159148 |
Porous alumina templates for electronic packages |
Cyprian Emeka Uzoh, Belgacem Haba, Ilyas Mohammed |
2018-12-18 |
| 10147548 |
Capacitors using porous alumina structures |
Cyprian Emeka Uzoh |
2018-12-04 |
| 10103121 |
Tall and fine pitch interconnects |
Cyprian Emeka Uzoh |
2018-10-16 |
| 10090231 |
Conductive connections, structures with such connections, and methods of manufacture |
Cyprian Emeka Uzoh |
2018-10-02 |
| 10049998 |
Conductive connections, structures with such connections, and methods of manufacture |
Cyprian Emeka Uzoh |
2018-08-14 |
| 10043779 |
Packaged microelectronic device for a package-on-package device |
Ashok S. Prabhu |
2018-08-07 |
| 10032647 |
Low CTE component with wire bond interconnects |
Cyprian Emeka Uzoh |
2018-07-24 |
| 10026717 |
Multiple bond via arrays of different wire heights on a same substrate |
Cyprian Emeka Uzoh |
2018-07-17 |
| 10014243 |
Interconnection substrates for interconnection between circuit modules, and methods of manufacture |
Hong Shen, Liang Wang, Gabriel Z. Guevara, Cyprian Emeka Uzoh, Laura Wills Mirkarimi |
2018-07-03 |
| 10008534 |
Microelectronic package with horizontal and vertical interconnections |
Cyprian Emeka Uzoh |
2018-06-26 |
| 10008469 |
Wafer-level packaging using wire bond wires in place of a redistribution layer |
Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more |
2018-06-26 |
| 10002844 |
Bonded structures |
Liang Wang, Javier A. Delacruz, Arkalgud R. Sitaram |
2018-06-19 |
| 9947641 |
Wire bond support structure and microelectronic package including wire bonds therefrom |
Reynaldo Co, Wael Zohni, Rizza Lee Saga Cizek |
2018-04-17 |
| 9911718 |
‘RDL-First’ packaged microelectronic device for a package-on-package device |
Ashok S. Prabhu |
2018-03-06 |
| 9899442 |
Image sensor device |
— |
2018-02-20 |
| 9888584 |
Contact structures with porous networks for solder connections, and methods of fabricating same |
Liang Wang, Hong Shen, Cyprian Emeka Uzoh |
2018-02-06 |
| 9887166 |
Integrated circuit assemblies with reinforcement frames, and methods of manufacture |
Laura Wills Mirkarimi, Arkalgud R. Sitaram, Charles G. Woychik |
2018-02-06 |
| 9871019 |
Flipped die stack assemblies with leadframe interconnects |
Ashok S. Prabhu, Liang Wang, Cyprian Emeka Uzoh |
2018-01-16 |
| 9865548 |
Polymer member based interconnect |
Cyprian Emeka Uzoh, Charles G. Woychik, Guilian Gao, Arkalgud R. Sitaram |
2018-01-09 |
| 9865675 |
Making multilayer 3D capacitors using arrays of upstanding rods or ridges |
Liang Wang, Hong Shen, Cyprian Emeka Uzoh |
2018-01-09 |
| 9859257 |
Flipped die stacks with multiple rows of leadframe interconnects |
Javier A. Delacruz, Belgacem Haba, Tu Tam Vu |
2018-01-02 |