Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103094 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more | 2018-10-16 |
| 9991231 | Stacked die integrated circuit | Cyprian Emeka Uzoh, Ron Zhang, Daniel Buckminster, Guilian Gao | 2018-06-05 |
| 9953957 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Cyprian Emeka Uzoh, Liang Wang | 2018-04-24 |
| 9953910 | Demountable interconnect structure | Raymond Albert Fillion | 2018-04-24 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2018-04-17 |
| 9905507 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Hong Shen, Zhuowen Sun, Arkalgud R. Sitaram | 2018-02-27 |
| 9899281 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Hong Shen, Arkalgud R. Sitaram | 2018-02-20 |
| 9893030 | Reliable device assembly | Cyprian Emeka Uzoh, Belgacem Haba, Michael Newman, Terrence Caskey | 2018-02-13 |
| 9887166 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2018-02-06 |
| 9875955 | Low cost hybrid high density package | Kishor Desai, Qwai H. Low, Chok J. Chia, Huailiang Wei | 2018-01-23 |
| 9865548 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Guilian Gao, Arkalgud R. Sitaram | 2018-01-09 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Guilian Gao, Bongsub Lee, Scott McGrath, Hong Shen +2 more | 2018-01-02 |