Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991231 | Stacked die integrated circuit | Charles G. Woychik, Cyprian Emeka Uzoh, Ron Zhang, Daniel Buckminster | 2018-06-05 |
| 9953957 | Embedded graphite heat spreader for 3DIC | Charles G. Woychik, Cyprian Emeka Uzoh, Liang Wang | 2018-04-24 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2018-04-17 |
| 9865548 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Charles G. Woychik, Arkalgud R. Sitaram | 2018-01-09 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Bongsub Lee, Scott McGrath, Hong Shen, Charles G. Woychik +2 more | 2018-01-02 |