Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163833 | Multichip modules and methods of fabrication | Liang Wang, Rajesh Katkar | 2018-12-25 |
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2018-07-03 |
| 9946712 | Techniques for user identification of and translation of media | — | 2018-04-17 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Zhuowen Sun, Liang Wang +1 more | 2018-04-17 |
| 9905523 | Microelectronic assemblies formed using metal silicide, and methods of fabrication | Liang Wang, Arkalgud R. Sitaram | 2018-02-27 |
| 9905507 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Zhuowen Sun, Charles G. Woychik, Arkalgud R. Sitaram | 2018-02-27 |
| 9899281 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Charles G. Woychik, Arkalgud R. Sitaram | 2018-02-20 |
| 9888584 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2018-02-06 |
| 9865675 | Making multilayer 3D capacitors using arrays of upstanding rods or ridges | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2018-01-09 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Guilian Gao, Bongsub Lee, Scott McGrath, Charles G. Woychik +2 more | 2018-01-02 |