Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2018-07-03 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2018-06-26 |
| 9972582 | Warpage balancing in thin packages | Belgacem Haba, Sangil Lee, Craig Mitchell, Javier A. Delacruz | 2018-05-15 |