Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10149377 | Stacked transmission line | Shaowu Huang, Belgacem Haba | 2018-12-04 |
| 10050003 | Elongated pad structure | — | 2018-08-14 |
| 10018670 | Wireless probes | — | 2018-07-10 |
| 10002844 | Bonded structures | Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2018-06-19 |
| 9984997 | Communication interface architecture using serializer/deserializer | — | 2018-05-29 |
| 9984992 | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces | Abiola Awujoola, Ashok S. Prabhu, Christopher W. Lattin, Zhuowen Sun | 2018-05-29 |
| 9972582 | Warpage balancing in thin packages | Belgacem Haba, Sangil Lee, Craig Mitchell, Gabriel Z. Guevara | 2018-05-15 |
| 9935075 | Wire bonding method and apparatus for electromagnetic interference shielding | Shaowu Huang | 2018-04-03 |
| 9859257 | Flipped die stacks with multiple rows of leadframe interconnects | Belgacem Haba, Tu Tam Vu, Rajesh Katkar | 2018-01-02 |