Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115678 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2018-10-30 |
| 10043779 | Packaged microelectronic device for a package-on-package device | Rajesh Katkar | 2018-08-07 |
| 9991233 | Package-on-package devices with same level WLP components and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-06-05 |
| 9991235 | Package on-package devices with upper RDL of WLPS and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-06-05 |
| 9985007 | Package on-package devices with multiple levels and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-29 |
| 9984992 | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces | Javier A. Delacruz, Abiola Awujoola, Christopher W. Lattin, Zhuowen Sun | 2018-05-29 |
| 9972609 | Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-15 |
| 9972573 | Wafer-level packaged components and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-15 |
| 9911718 | ‘RDL-First’ packaged microelectronic device for a package-on-package device | Rajesh Katkar | 2018-03-06 |
| 9871019 | Flipped die stack assemblies with leadframe interconnects | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh | 2018-01-16 |