| 9991233 |
Package-on-package devices with same level WLP components and methods therefor |
Min Tao, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba |
2018-06-05 |
| 9991235 |
Package on-package devices with upper RDL of WLPS and methods therefor |
Min Tao, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba |
2018-06-05 |
| 9985007 |
Package on-package devices with multiple levels and methods therefor |
Min Tao, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba |
2018-05-29 |
| 9972573 |
Wafer-level packaged components and methods therefor |
Min Tao, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba |
2018-05-15 |
| 9972609 |
Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor |
Min Tao, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba |
2018-05-15 |
| 9891856 |
Memory address remapping system, device and method of performing address remapping operation |
Won-Hyung Song, Duk-Sung Kim, Soo-woong Ahn, Ha Yoon, Ju-Yun Jung |
2018-02-13 |
