Issued Patents 2018
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115678 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2018-10-30 |
| 10090280 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2018-10-02 |
| 10032752 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2018-07-24 |
| 10008477 | Microelectronic element with bond elements to encapsulation surface | Belgacem Haba, Richard Dewitt Crisp | 2018-06-26 |
| 9991233 | Package-on-package devices with same level WLP components and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2018-06-05 |
| 9991235 | Package on-package devices with upper RDL of WLPS and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2018-06-05 |
| 9985007 | Package on-package devices with multiple levels and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2018-05-29 |
| 9972573 | Wafer-level packaged components and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2018-05-15 |
| 9972609 | Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2018-05-15 |
| 9947641 | Wire bond support structure and microelectronic package including wire bonds therefrom | Reynaldo Co, Rizza Lee Saga Cizek, Rajesh Katkar | 2018-04-17 |
| 9928883 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Kyong-Mo Bang, Belgacem Haba | 2018-03-27 |
| 9905502 | Sintered conductive matrix material on wire bond | — | 2018-02-27 |
| 9893033 | Off substrate kinking of bond wire | Belgacem Haba, Reynaldo Co, Rizza Lee Saga Cizek | 2018-02-13 |
| 9888579 | Pressing of wire bond wire tips to provide bent-over tips | Reynaldo Co, Grant Villavicencio | 2018-02-06 |