Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026467 | High-bandwidth memory application with controlled impedance loading | Zhuowen Sun, Yong-Syuan Chen | 2018-07-17 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Xuan Li, Long Huynh +4 more | 2018-06-26 |
| 9928883 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Belgacem Haba, Wael Zohni | 2018-03-27 |
| 9911717 | Stackable microelectronic package structures | Belgacem Haba | 2018-03-06 |