Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Long Huynh +4 more | 2018-06-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Long Huynh +4 more | 2018-06-26 |