Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Bongsub Lee, Kyong-Mo Bang, Xuan Li, Long Huynh +4 more | 2018-06-26 |
| 9859257 | Flipped die stacks with multiple rows of leadframe interconnects | Javier A. Delacruz, Belgacem Haba, Rajesh Katkar | 2018-01-02 |