Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090280 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2018-10-02 |
| 10032752 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2018-07-24 |
| 10008477 | Microelectronic element with bond elements to encapsulation surface | Belgacem Haba, Wael Zohni | 2018-06-26 |