Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10151887 | Hardened fiber optic connectors having a mechanical splice connector assembly | Michael de Jong, Wolf Peter Kluwe, Daniel Leyva, Jr. | 2018-12-11 |
| 9991233 | Package-on-package devices with same level WLP components and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-06-05 |
| 9991235 | Package on-package devices with upper RDL of WLPS and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-06-05 |
| 9985007 | Package on-package devices with multiple levels and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-29 |
| 9972573 | Wafer-level packaged components and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-15 |
| 9972609 | Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2018-05-15 |