Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947641 | Wire bond support structure and microelectronic package including wire bonds therefrom | Wael Zohni, Rizza Lee Saga Cizek, Rajesh Katkar | 2018-04-17 |
| 9893033 | Off substrate kinking of bond wire | Belgacem Haba, Rizza Lee Saga Cizek, Wael Zohni | 2018-02-13 |
| 9888579 | Pressing of wire bond wire tips to provide bent-over tips | Grant Villavicencio, Wael Zohni | 2018-02-06 |