Issued Patents 2018
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163833 | Multichip modules and methods of fabrication | Rajesh Katkar, Hong Shen | 2018-12-25 |
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2018-07-03 |
| 10008652 | Light emitting diode device with reconstituted LED components on substrate | Eric Tosaya | 2018-06-26 |
| 10002844 | Bonded structures | Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2018-06-19 |
| 9953957 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Charles G. Woychik, Cyprian Emeka Uzoh | 2018-04-24 |
| 9947643 | Inverted optical device | Ilyas Mohammed, Masud Beroz | 2018-04-17 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2018-04-17 |
| 9905523 | Microelectronic assemblies formed using metal silicide, and methods of fabrication | Hong Shen, Arkalgud R. Sitaram | 2018-02-27 |
| 9888584 | Contact structures with porous networks for solder connections, and methods of fabricating same | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh | 2018-02-06 |
| 9871019 | Flipped die stack assemblies with leadframe interconnects | Ashok S. Prabhu, Rajesh Katkar, Cyprian Emeka Uzoh | 2018-01-16 |
| 9865675 | Making multilayer 3D capacitors using arrays of upstanding rods or ridges | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh | 2018-01-09 |