Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh | 2018-07-03 |
| 10008469 | Wafer-level packaging using wire bond wires in place of a redistribution layer | Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li +4 more | 2018-06-26 |
| 9899353 | Off-chip vias in stacked chips | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky | 2018-02-20 |
| 9887166 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Arkalgud R. Sitaram, Charles G. Woychik | 2018-02-06 |