Issued Patents 2018
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163757 | Method and structures for via substrate repair and assembly | — | 2018-12-25 |
| 10163675 | Method and apparatus for stacking devices in an integrated circuit assembly | — | 2018-12-25 |
| 10159148 | Porous alumina templates for electronic packages | Rajesh Katkar, Belgacem Haba, Ilyas Mohammed | 2018-12-18 |
| 10147548 | Capacitors using porous alumina structures | Rajesh Katkar | 2018-12-04 |
| 10103094 | Method and structures for heat dissipating interposers | Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2018-10-16 |
| 10103121 | Tall and fine pitch interconnects | Rajesh Katkar | 2018-10-16 |
| 10103093 | Via structure for signal equalization | Zhuowen Sun, Yong-Syuan Chen | 2018-10-16 |
| 10090231 | Conductive connections, structures with such connections, and methods of manufacture | Rajesh Katkar | 2018-10-02 |
| 10049998 | Conductive connections, structures with such connections, and methods of manufacture | Rajesh Katkar | 2018-08-14 |
| 10037940 | Reliable packaging and interconnect structures | Belgacem Haba, Craig Mitchell | 2018-07-31 |
| 10032647 | Low CTE component with wire bond interconnects | Rajesh Katkar | 2018-07-24 |
| 10032715 | Ultra high performance interposer | Zhuowen Sun | 2018-07-24 |
| 10026717 | Multiple bond via arrays of different wire heights on a same substrate | Rajesh Katkar | 2018-07-17 |
| 10015881 | Cavities containing multi-wiring structures and devices | Craig Mitchell, Belgacem Haba, Ilyas Mohammed | 2018-07-03 |
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Laura Wills Mirkarimi | 2018-07-03 |
| 10008534 | Microelectronic package with horizontal and vertical interconnections | Rajesh Katkar | 2018-06-26 |
| 9991231 | Stacked die integrated circuit | Charles G. Woychik, Ron Zhang, Daniel Buckminster, Guilian Gao | 2018-06-05 |
| 9953957 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Charles G. Woychik, Liang Wang | 2018-04-24 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2018-04-17 |
| 9905537 | Compact semiconductor package and related methods | — | 2018-02-27 |
| 9905713 | Method and substrates for material application | Emeka Nchekwube | 2018-02-27 |
| 9893030 | Reliable device assembly | Belgacem Haba, Charles G. Woychik, Michael Newman, Terrence Caskey | 2018-02-13 |
| 9888584 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Hong Shen | 2018-02-06 |
| 9877487 | Compositions for effective fly population suppression | Emeka Nchekwube | 2018-01-30 |
| 9871019 | Flipped die stack assemblies with leadframe interconnects | Ashok S. Prabhu, Rajesh Katkar, Liang Wang | 2018-01-16 |