Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103094 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2018-10-16 |
| 9893030 | Reliable device assembly | Cyprian Emeka Uzoh, Belgacem Haba, Charles G. Woychik, Michael Newman | 2018-02-13 |
| 9876002 | Microelectronic package with stacked microelectronic units and method for manufacture thereof | Ilyas Mohammed | 2018-01-23 |