Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032751 | Ultrathin layer for forming a capacitive interface between joined integrated circuit components | Belgacem Haba | 2018-07-24 |
| 10002844 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2018-06-19 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2018-04-17 |
| 9905507 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Hong Shen, Zhuowen Sun, Charles G. Woychik | 2018-02-27 |
| 9905523 | Microelectronic assemblies formed using metal silicide, and methods of fabrication | Hong Shen, Liang Wang | 2018-02-27 |
| 9899281 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Hong Shen, Charles G. Woychik | 2018-02-20 |
| 9887166 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Laura Wills Mirkarimi, Charles G. Woychik | 2018-02-06 |
| 9865548 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Charles G. Woychik, Guilian Gao | 2018-01-09 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Guilian Gao, Bongsub Lee, Scott McGrath, Hong Shen +2 more | 2018-01-02 |