Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953910 | Demountable interconnect structure | Charles G. Woychik | 2018-04-24 |
| 9953913 | Electronics package with embedded through-connect structure and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee | 2018-04-24 |
| 9953917 | Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee | 2018-04-24 |