Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163773 | Electronics package having a self-aligning interconnect assembly and method of making same | Christopher James Kapusta, Kaustubh Ravindra Nagarkar, James Wilson Rose | 2018-12-25 |
| 10141203 | Electrical interconnect structure for an embedded electronics package | Paul Alan McConnelee | 2018-11-27 |
| 10141251 | Electronic packages with pre-defined via patterns and methods of making and using the same | Paul Alan McConnelee, Risto Tuominen | 2018-11-27 |
| 10068879 | Three-dimensional stacked integrated circuit devices and methods of assembling the same | — | 2018-09-04 |
| 10070531 | Overlay circuit structure for interconnecting light emitting semiconductors | Donald Paul Cunningham, Shakti Singh Chauhan | 2018-09-04 |
| 9966371 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Risto Tuominen | 2018-05-08 |
| 9966361 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Risto Tuominen | 2018-05-08 |
| 9953917 | Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof | Raymond Albert Fillion, Paul Alan McConnelee | 2018-04-24 |
| 9953913 | Electronics package with embedded through-connect structure and method of manufacturing thereof | Raymond Albert Fillion, Paul Alan McConnelee | 2018-04-24 |