Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147685 | System-in-package devices with magnetic shielding | Phillip R. Sommer, Shankar S. Pennathur, Meng Chi Lee, Yanfeng Chen | 2018-12-04 |
| 10115677 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2018-10-30 |
| 10109593 | Self shielded system in package (SiP) modules | Meng Chi Lee, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2018-10-23 |
| 10070531 | Overlay circuit structure for interconnecting light emitting semiconductors | Arun Virupaksha Gowda, Donald Paul Cunningham | 2018-09-04 |