Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115677 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Shakti Singh Chauhan, Jun Chung Hsu, Tha-An Lin | 2018-10-30 |
| 10109593 | Self shielded system in package (SiP) modules | Meng Chi Lee, Shakti Singh Chauhan, Jun Chung Hsu, Tha-An Lin | 2018-10-23 |
| 9899239 | Carrier ultra thin substrate | Jun Chung Hsu, Kwan-Yu Lai | 2018-02-20 |