Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115671 | Incorporation of passives and fine pitch through via for package on package | Ravindra V. Shenoy, Philip Jason Stephanou, Mario Francisco Velez, Jonghae Kim, Evgeni Gousev | 2018-10-30 |
| 10102962 | Integrated magnetic passive devices using magnetic film | David P. Cappabianca, Zhitao Cao | 2018-10-16 |
| 9899239 | Carrier ultra thin substrate | Jun Chung Hsu, Flynn Carson | 2018-02-20 |