Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9875955 | Low cost hybrid high density package | Qwai H. Low, Chok J. Chia, Charles G. Woychik, Huailiang Wei | 2018-01-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9875955 | Low cost hybrid high density package | Qwai H. Low, Chok J. Chia, Charles G. Woychik, Huailiang Wei | 2018-01-23 |