Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508593 | Method of depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki, Erich R. Klawuhn | 2016-11-29 |
| 9502238 | Deposition of conformal films by atomic layer deposition and atomic layer etch | Jon Henri, Shane Tang | 2016-11-22 |
| 9478411 | Method to tune TiOx stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiOx/Ti based MIS contact scheme for CMOS | Shruti Vivek Thombare, Ishtak Karim, Sanjay Gopinath, Reza Arghavani | 2016-10-25 |
| 9478438 | Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursor | Shruti Vivek Thombare, Ishtak Karim, Sanjay Gopinath | 2016-10-25 |
| 9362163 | Methods and apparatuses for atomic layer cleaning of contacts and vias | Juwen Gao, Aaron R. Fellis, Francisco Juarez, Chiukin Steven Lai | 2016-06-07 |
| 9355886 | Conformal film deposition for gapfill | Shankar Swaminathan, Bart J. van Schravendijk, Adrien LaVoie, Sesha Varadarajan, Jason D. Park +1 more | 2016-05-31 |
| 9349637 | Method for void-free cobalt gap fill | Jeong-Seok Na, Tianhua Yu, Sanjay Gopinath | 2016-05-24 |
| 9257302 | CVD flowable gap fill | Feng Wang, Victor Lu, Brian Lu, Wai-Fan Yau, Nerissa Draeger +4 more | 2016-02-09 |
| 9240347 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Juwen Gao, Deqi Wang | 2016-01-19 |
| 9236297 | Low tempature tungsten film deposition for small critical dimension contacts and interconnects | Feng Chen, Raashina Humayun, Anand Chandrashekar | 2016-01-12 |