Issued Patents 2016
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9483681 | Method of 3D biometrics identification | Cyril Kwong | 2016-11-01 |
| 9460966 | Method and apparatus for dicing wafers having thick passivation polymer layer | Wei-Sheng Lei, Brad Eaton | 2016-10-04 |
| 9443765 | Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing | Wei-Sheng Lei, James S. Papanu, Prabhat Kumar, Brad Eaton | 2016-09-13 |
| 9425062 | Method for improving CD micro-loading in photomask plasma etching | Zhigang Mao, Xiaoyi Chen, Amitabh Sabharwal | 2016-08-23 |
| 9412619 | Method of outgassing a mask material deposited over a workpiece in a process tool | Prabhat Kumar, Wei-Sheng Lei, Martin S. Wohlert, James S. Papanu, Brad Eaton | 2016-08-09 |
| 9401722 | Autoconfigurable phase-locked loop which automatically maintains a constant damping factor and adjusts the loop bandwidth to a constant ratio of the reference frequency | Krishnaswamy Nagaraj, Joonsung Park | 2016-07-26 |
| 9355907 | Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process | Wei-Sheng Lei, Jungrae Park, Prabhat Kumar, James S. Papanu, Brad Eaton | 2016-05-31 |
| 9349648 | Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process | Wei-Sheng Lei, Prabhat Kumar, Jungrae Park, Brad Eaton | 2016-05-24 |
| 9343366 | Dicing wafers having solder bumps on wafer backside | Wei-Sheng Lei, James S. Papanu, Aparna Iyer, Brad Eaton | 2016-05-17 |
| 9330977 | Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process | Wei-Sheng Lei, Brad Eaton | 2016-05-03 |
| 9312177 | Screen print mask for laser scribe and plasma etch wafer dicing process | Prabhat Kumar, Brad Eaton, Wei-Sheng Lei, James S. Papanu | 2016-04-12 |
| 9299614 | Method and carrier for dicing a wafer | James M. Holden, Brad Eaton, Aparna Iyer | 2016-03-29 |
| 9299611 | Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance | Wei-Sheng Lei, Brad Eaton, James S. Papanu, Jungrae Park | 2016-03-29 |
| 9287093 | Dynamic ion radical sieve and ion radical aperture for an inductively coupled plasma (ICP) reactor | Saravjeet Singh, Graeme Scott | 2016-03-15 |
| 9281244 | Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2016-03-08 |
| 9280051 | Methods for reducing line width roughness and/or critical dimension nonuniformity in a patterned photoresist layer | Banqiu Wu, Rao Yalamanchili, Omkaram Nalamasu | 2016-03-08 |
| 9275902 | Dicing processes for thin wafers with bumps on wafer backside | Wei-Sheng Lei, James S. Papanu, Aparna Iyer, Brad Eaton | 2016-03-01 |
| 9269604 | Wafer edge warp suppression for thin wafer supported by tape frame | Wei-Sheng Lei, Brad Eaton | 2016-02-23 |
| 9263308 | Water soluble mask for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Saravjeet Singh, Madhava Rao Yalamanchili, Brad Eaton | 2016-02-16 |
| 9252057 | Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili | 2016-02-02 |
| 9250514 | Apparatus and methods for fabricating a photomask substrate for EUV applications | Banqiu Wu | 2016-02-02 |
| 9245802 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, James M. Holden | 2016-01-26 |
| 9245803 | Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2016-01-26 |
| 9236305 | Wafer dicing with etch chamber shield ring for film frame wafer applications | Wei-Sheng Lei, Saravjeet Singh, Jivko Dinev, Aparna Iyer, Brad Eaton | 2016-01-12 |