Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443765 | Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing | Wei-Sheng Lei, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2016-09-13 |
| 9412619 | Method of outgassing a mask material deposited over a workpiece in a process tool | Prabhat Kumar, Wei-Sheng Lei, Martin S. Wohlert, Brad Eaton, Ajay Kumar | 2016-08-09 |
| 9355907 | Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process | Wei-Sheng Lei, Jungrae Park, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2016-05-31 |
| 9343366 | Dicing wafers having solder bumps on wafer backside | Wei-Sheng Lei, Aparna Iyer, Brad Eaton, Ajay Kumar | 2016-05-17 |
| 9312177 | Screen print mask for laser scribe and plasma etch wafer dicing process | Prabhat Kumar, Brad Eaton, Wei-Sheng Lei, Ajay Kumar | 2016-04-12 |
| 9299611 | Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance | Wei-Sheng Lei, Brad Eaton, Ajay Kumar, Jungrae Park | 2016-03-29 |
| 9281244 | Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2016-03-08 |
| 9275902 | Dicing processes for thin wafers with bumps on wafer backside | Wei-Sheng Lei, Aparna Iyer, Brad Eaton, Ajay Kumar | 2016-03-01 |
| 9245803 | Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2016-01-26 |