| 9460966 |
Method and apparatus for dicing wafers having thick passivation polymer layer |
Wei-Sheng Lei, Ajay Kumar |
2016-10-04 |
| 9443765 |
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing |
Wei-Sheng Lei, James S. Papanu, Prabhat Kumar, Ajay Kumar |
2016-09-13 |
| 9412619 |
Method of outgassing a mask material deposited over a workpiece in a process tool |
Prabhat Kumar, Wei-Sheng Lei, Martin S. Wohlert, James S. Papanu, Ajay Kumar |
2016-08-09 |
| 9355907 |
Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process |
Wei-Sheng Lei, Jungrae Park, Prabhat Kumar, James S. Papanu, Ajay Kumar |
2016-05-31 |
| 9349648 |
Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process |
Wei-Sheng Lei, Prabhat Kumar, Jungrae Park, Ajay Kumar |
2016-05-24 |
| 9343366 |
Dicing wafers having solder bumps on wafer backside |
Wei-Sheng Lei, James S. Papanu, Aparna Iyer, Ajay Kumar |
2016-05-17 |
| 9330977 |
Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process |
Wei-Sheng Lei, Ajay Kumar |
2016-05-03 |
| 9312177 |
Screen print mask for laser scribe and plasma etch wafer dicing process |
Prabhat Kumar, Wei-Sheng Lei, James S. Papanu, Ajay Kumar |
2016-04-12 |
| 9299614 |
Method and carrier for dicing a wafer |
James M. Holden, Aparna Iyer, Ajay Kumar |
2016-03-29 |
| 9299611 |
Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance |
Wei-Sheng Lei, Ajay Kumar, James S. Papanu, Jungrae Park |
2016-03-29 |
| 9281244 |
Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process |
Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar |
2016-03-08 |
| 9275902 |
Dicing processes for thin wafers with bumps on wafer backside |
Wei-Sheng Lei, James S. Papanu, Aparna Iyer, Ajay Kumar |
2016-03-01 |
| 9269604 |
Wafer edge warp suppression for thin wafer supported by tape frame |
Wei-Sheng Lei, Ajay Kumar |
2016-02-23 |
| 9263308 |
Water soluble mask for substrate dicing by laser and plasma etch |
Wei-Sheng Lei, Saravjeet Singh, Madhava Rao Yalamanchili, Ajay Kumar |
2016-02-16 |
| 9252057 |
Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application |
Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar |
2016-02-02 |
| 9245802 |
Wafer dicing using femtosecond-based laser and plasma etch |
Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden |
2016-01-26 |
| 9245803 |
Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process |
Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar |
2016-01-26 |
| 9236305 |
Wafer dicing with etch chamber shield ring for film frame wafer applications |
Wei-Sheng Lei, Saravjeet Singh, Jivko Dinev, Aparna Iyer, Ajay Kumar |
2016-01-12 |
