Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9263308 | Water soluble mask for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Saravjeet Singh, Brad Eaton, Ajay Kumar | 2016-02-16 |
| 9252057 | Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Brad Eaton, Ajay Kumar | 2016-02-02 |
| 9245802 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2016-01-26 |