Issued Patents 2016
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9460966 | Method and apparatus for dicing wafers having thick passivation polymer layer | Brad Eaton, Ajay Kumar | 2016-10-04 |
| 9443765 | Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing | James S. Papanu, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2016-09-13 |
| 9412619 | Method of outgassing a mask material deposited over a workpiece in a process tool | Prabhat Kumar, Martin S. Wohlert, James S. Papanu, Brad Eaton, Ajay Kumar | 2016-08-09 |
| 9355907 | Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process | Jungrae Park, Prabhat Kumar, James S. Papanu, Brad Eaton, Ajay Kumar | 2016-05-31 |
| 9349648 | Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process | Prabhat Kumar, Jungrae Park, Brad Eaton, Ajay Kumar | 2016-05-24 |
| 9343366 | Dicing wafers having solder bumps on wafer backside | James S. Papanu, Aparna Iyer, Brad Eaton, Ajay Kumar | 2016-05-17 |
| 9330977 | Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process | Brad Eaton, Ajay Kumar | 2016-05-03 |
| 9312177 | Screen print mask for laser scribe and plasma etch wafer dicing process | Prabhat Kumar, Brad Eaton, James S. Papanu, Ajay Kumar | 2016-04-12 |
| 9299611 | Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance | Brad Eaton, Ajay Kumar, James S. Papanu, Jungrae Park | 2016-03-29 |
| 9281244 | Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process | Jungrae Park, James S. Papanu, Brad Eaton, Ajay Kumar | 2016-03-08 |
| 9275902 | Dicing processes for thin wafers with bumps on wafer backside | James S. Papanu, Aparna Iyer, Brad Eaton, Ajay Kumar | 2016-03-01 |
| 9269604 | Wafer edge warp suppression for thin wafer supported by tape frame | Brad Eaton, Ajay Kumar | 2016-02-23 |
| 9263308 | Water soluble mask for substrate dicing by laser and plasma etch | Saravjeet Singh, Madhava Rao Yalamanchili, Brad Eaton, Ajay Kumar | 2016-02-16 |
| 9252057 | Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application | Mohammad Kamruzzaman Chowdhury, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2016-02-02 |
| 9245802 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2016-01-26 |
| 9245803 | Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process | Jungrae Park, James S. Papanu, Brad Eaton, Ajay Kumar | 2016-01-26 |
| 9236305 | Wafer dicing with etch chamber shield ring for film frame wafer applications | Saravjeet Singh, Jivko Dinev, Aparna Iyer, Brad Eaton, Ajay Kumar | 2016-01-12 |