Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343366 | Dicing wafers having solder bumps on wafer backside | Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar | 2016-05-17 |
| 9299614 | Method and carrier for dicing a wafer | James M. Holden, Brad Eaton, Ajay Kumar | 2016-03-29 |
| 9275902 | Dicing processes for thin wafers with bumps on wafer backside | Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar | 2016-03-01 |
| 9236305 | Wafer dicing with etch chamber shield ring for film frame wafer applications | Wei-Sheng Lei, Saravjeet Singh, Jivko Dinev, Brad Eaton, Ajay Kumar | 2016-01-12 |