Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process

Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process

US Patent 9355907 · Granted May 31, 2016

Estimated economic value: $8,928,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Water vapor plasma to enhance surface hydrophilicity2025
Image localizability classifier2025
Asynchronous crypto asset transfer and social aggregating, fractionally efficien2025
Methods and apparatus for mask patterning debris removal2025
High connectivity device stacking2025
Lithium metal surface modification using carbonate passivation2025
Method and apparatus for laser drilling blind vias2025
Gap fill methods using catalyzed deposition2025
Intelligent cabin management system for automated check of basic safety norms an2025
Spread spectrum adjustment for an LC circuit2025
Fluid reactors2025
Dual agent reinforcement learning based system for autonomous operation of aircr2025