Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8252609 | Curvature reduction for semiconductor wafers | Steven Lee Prins, Amitabh Jain | 2012-08-28 |
| 8216945 | Wafer planarity control between pattern levels | Steven Lee Prins, Amitabh Jain | 2012-07-10 |
| 8058161 | Recessed STI for wide transistors | Gabriel G. Barna, Andrew Marshall | 2011-11-15 |
| 8043921 | Nitride removal while protecting semiconductor surfaces for forming shallow junctions | Deborah J. Riley | 2011-10-25 |
| 7998865 | Systems and methods for removing wafer edge residue and debris using a residue remover mechanism | Joe G. Tran, Alfred Griffin | 2011-08-16 |
| 7968443 | Cross-contamination control for processing of circuits comprising MOS devices that include metal comprising high-K dielectrics | James Joseph Chambers | 2011-06-28 |
| 7943456 | Selective wet etch process for CMOS ICs having embedded strain inducing regions and integrated circuits therefrom | Shaofeng Yu, Freidoon Mehrad | 2011-05-17 |
| 7927993 | Cross-contamination control for semiconductor process flows having metal comprising gate electrodes | — | 2011-04-19 |
| 7838356 | Gate dielectric first replacement gate processes and integrated circuits therefrom | Freidoon Mehrad, Shaofeng Yu | 2010-11-23 |
| 7785957 | Post metal gate VT adjust etch clean | Jinhan Choi, Randall W. Pak | 2010-08-31 |
| 7732284 | Post high-k dielectric/metal gate clean | Jinhan Choi, Deborah J. Riley | 2010-06-08 |
| 7504339 | Method to form shallow trench isolation with rounded upper corner for advanced semiconductor circuits | Zhihao Chen, Freidoon Mehrad, Jeff White, Edmund G. Russell, Jon Holt +1 more | 2009-03-17 |
| 7402524 | Post high voltage gate oxide pattern high-vacuum outgas surface treatment | Rajesh Khamankar, Malcolm J. Bevan, April Gurba, Husam N. Alshareef, Clinton L. Montgomery +1 more | 2008-07-22 |
| 7384869 | Protection of silicon from phosphoric acid using thick chemical oxide | Deborah J. Riley, Brian Trentman | 2008-06-10 |
| 7339240 | Dual-gate integrated circuit semiconductor device | Rajesh Khamankar, Malcolm J. Bevan, April Gurba, Husam N. Alshareef, Clinton L. Montgomery +1 more | 2008-03-04 |
| 7186651 | Chemical mechanical polishing method and apparatus | Joe G. Tran, Chad Kaneshige | 2007-03-06 |
| 7049242 | Post high voltage gate dielectric pattern plasma surface treatment | Rajesh Khamankar, Malcolm J. Bevan, April Gurba, Husam N. Alshareef, Clinton L. Montgomery +1 more | 2006-05-23 |
| 7018925 | Post high voltage gate oxide pattern high-vacuum outgas surface treatment | Rajesh Khamankar, Malcolm J. Bevan, April Gurba, Husam N. Alshareef, Clinton L. Montgomery +1 more | 2006-03-28 |
| 6921721 | Post plasma clean process for a hardmask | Clint Montgomery, Brian Trentman, Randall W. Pak | 2005-07-26 |
| 6917093 | Method to form shallow trench isolation with rounded upper corner for advanced semiconductor circuits | Zhihao Chen, Freidoon Mehrad, Jeff White, Edmund G. Russell, Jon Holt +1 more | 2005-07-12 |
| 6869862 | Method for improving a physical property defect value of a gate dielectric | Mercer Brugler, Eddie Hearl Breashears, Jon Holt, Corbett Zabierek, Rajesh Khamankar | 2005-03-22 |
| 6861348 | Pre-pattern surface modification of low-k dielectrics | Michael Morrison, Andrew John McKerrow, Kenneth Newton, Dirk N. Anderson | 2005-03-01 |
| 6831008 | Nickel silicide—silicon nitride adhesion through surface passivation | Jiong-Ping Lu, Glenn J. Tessmer, Melissa Hewson, Donald Miles, Ralf B. Willecke +2 more | 2004-12-14 |
| 6797644 | Method to reduce charge interface traps and channel hot carrier degradation | Victor Watt, Beth Walden, Edmund G. Russell | 2004-09-28 |
| 6720247 | Pre-pattern surface modification for low-k dielectrics using A H2 plasma | Michael Morrison, Andrew John McKerrow, Kenneth Newton, Dirk N. Anderson | 2004-04-13 |