Issued Patents All Time
Showing 76–100 of 184 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6217972 | Enhancements in framed sheet processing | Masud Beroz, Matthew T. Hendrickson, David Light, John W. Smith | 2001-04-17 |
| 6218215 | Methods of encapsulating a semiconductor chip using a settable encapsulant | Craig Mitchell | 2001-04-17 |
| 6215191 | Compliant lead structures for microelectronic devices | Masud Beroz, Konstantine Karavakis | 2001-04-10 |
| 6208024 | Microelectronic mounting with multiple lead deformation using restraining straps | — | 2001-03-27 |
| 6205660 | Method of making an electronic contact | Joseph Fjelstad, John W. Smith, James Zaccardi, A. Christian Walton | 2001-03-27 |
| 6208025 | Microelectronic component with rigid interposer | Pieter H. Bellaar, Joseph Fjelstad, Christopher M. Pickett, John W. Smith | 2001-03-27 |
| 6202299 | Semiconductor chip connection components with adhesives and methods of making same | Gus Karavakis, Zlata Kovac, Craig Mitchell | 2001-03-20 |
| 6202297 | Socket for engaging bump leads on a microelectronic device and methods therefor | Anthony B. Faraci, James Zaccardi, John W. Smith | 2001-03-20 |
| 6196042 | Coining tool and process of manufacturing same for making connection components | Joseph Fjelstad, Belgacem Haba | 2001-03-06 |
| 6197665 | Lamination machine and method to laminate a coverlay to a microelectronic package | Craig Mitchell, Tan Nguyen | 2001-03-06 |
| 6194291 | Microelectronic assemblies with multiple leads | John W. Smith | 2001-02-27 |
| 6191473 | Bonding lead structure with enhanced encapsulation | — | 2001-02-20 |
| 6147400 | Connecting multiple microelectronic elements with lead deformation | Tony Faraci, John W. Smith | 2000-11-14 |
| 6133639 | Compliant interface for semiconductor chip and method therefor | Zlata Kovac, Craig Mitchell, John W. Smith | 2000-10-17 |
| 6133627 | Semiconductor chip package with center contacts | Igor Y. Khandros | 2000-10-17 |
| 6127724 | Packaged microelectronic elements with enhanced thermal conduction | — | 2000-10-03 |
| 6126428 | Vacuum dispense apparatus for dispensing an encapsulant | Craig Mitchell | 2000-10-03 |
| 6107123 | Methods for providing void-free layers for semiconductor assemblies | Joseph Fjelstad | 2000-08-22 |
| 6104087 | Microelectronic assemblies with multiple leads | John W. Smith | 2000-08-15 |
| 6086386 | Flexible connectors for microelectronic elements | Joseph Fjelstad, Konstantine Karavakis, Anthony B. Faraci, Tan Nguyen | 2000-07-11 |
| 6080603 | Fixtures and methods for lead bonding and deformation | John W. Smith, Anthony B. Faraci | 2000-06-27 |
| 6080605 | Methods of encapsulating a semiconductor chip using a settable encapsulant | Craig Mitchell | 2000-06-27 |
| 6081035 | Microelectronic bond ribbon design | Michael Warner, David Gibson | 2000-06-27 |
| 6075289 | Thermally enhanced packaged semiconductor assemblies | — | 2000-06-13 |
| 6054756 | Connection components with frangible leads and bus | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, Jason Sweis, Laurie Union +1 more | 2000-04-25 |