Issued Patents All Time
Showing 51–75 of 184 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6362520 | Microelectronic mounting with multiple lead deformation using restraining straps | — | 2002-03-26 |
| 6359335 | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures | John W. Smith, Craig Mitchell | 2002-03-19 |
| 6359236 | Mounting component with leads having polymeric strips | Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew | 2002-03-19 |
| 6357112 | Method of making connection component | Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light +1 more | 2002-03-19 |
| 6354485 | Thermally enhanced packaged semiconductor assemblies | — | 2002-03-12 |
| 6338982 | Enhancements in framed sheet processing | Masud Beroz, Matthew T. Hendrickson, David Light, John W. Smith | 2002-01-15 |
| 6335222 | Microelectronic packages with solder interconnections | — | 2002-01-01 |
| 6329224 | Encapsulation of microelectronic assemblies | Tan Nguyen, Craig Mitchell | 2001-12-11 |
| 6324754 | Method for fabricating microelectronic assemblies | Joseph Fjelstad | 2001-12-04 |
| 6309915 | Semiconductor chip package with expander ring and method of making same | — | 2001-10-30 |
| 6306752 | Connection component and method of making same | Joseph Fjeslstad, John W. Smith | 2001-10-23 |
| 6286205 | Method for making connections to a microelectronic device having bump leads | Anthony B. Faraci, James Zaccardi, John W. Smith | 2001-09-11 |
| 6272744 | Semiconductor connection components and methods with releasable lead support | Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew | 2001-08-14 |
| 6274820 | Electrical connections with deformable contacts | John W. Smith, Konstantine Karavakis, Zlata Kovac, Joseph Fjelstad | 2001-08-14 |
| 6274822 | Manufacture of semiconductor connection components with frangible lead sections | David Light, Belgacem Haba, Konstantine Karavakis | 2001-08-14 |
| 6266874 | Methods of making microelectronic components having electrophoretically deposited layers | John W. Smith, Konstantine Karavakis, Zlata Kovac, Joseph Fjelstad | 2001-07-31 |
| 6265765 | Fan-out semiconductor chip assembly | John W. Smith, Tony Faraci | 2001-07-24 |
| 6265759 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Joseph Fjelstad, John W. Smith | 2001-07-24 |
| 6261863 | Components with releasable leads and methods of making releasable leads | Masud Beroz, Anthony B. Faraci, Joseph Fjelstad, Belgacem Haba | 2001-07-17 |
| 6255738 | Encapsulant for microelectronic devices | Craig Mitchell, Mark Thorson, Zlata Kovac | 2001-07-03 |
| 6255723 | Layered lead structures | David Light, John W. Smith, David Rodney Baker, Hung-Ming Wang | 2001-07-03 |
| 6247228 | Electrical connection with inwardly deformable contacts | Joseph Fjelstad | 2001-06-19 |
| 6239386 | Electrical connections with deformable contacts | John W. Smith, Konstantine Karavakis, Zlata Kovac, Joseph Fjelstad | 2001-05-29 |
| 6232152 | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures | John W. Smith, Craig Mitchell | 2001-05-15 |
| 6228685 | Framed sheet processing | Masud Beroz, John W. Smith | 2001-05-08 |