Issued Patents All Time
Showing 101–125 of 184 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6045655 | Method of mounting a connection component on a semiconductor chip with adhesives | Gus Karavakis, Zlata Kovac, Craig Mitchell | 2000-04-04 |
| 6046076 | Vacuum dispense method for dispensing an encapsulant and machine therefor | Craig Mitchell | 2000-04-04 |
| 6044548 | Methods of making connections to a microelectronic unit | John W. Smith | 2000-04-04 |
| 6030856 | Bondable compliant pads for packaging of a semiconductor chip and method therefor | Zlata Kovac, John W. Smith | 2000-02-29 |
| 6012224 | Method of forming compliant microelectronic mounting device | John W. Smith, Zlata Kovac, Konstantine Karavakis | 2000-01-11 |
| 6007349 | Flexible contact post and post socket and associated methods therefor | Joseph Fjelstad | 1999-12-28 |
| 6002168 | Microelectronic component with rigid interposer | Pieter H. Bellaar, Joseph Fjelstad, Christopher M. Pickett, John W. Smith | 1999-12-14 |
| 5994222 | Method of making chip mountings and assemblies | John W. Smith | 1999-11-30 |
| 5980270 | Soldering with resilient contacts | Joseph Fjelstad, John W. Smith | 1999-11-09 |
| 5976913 | Microelectronic mounting with multiple lead deformation using restraining straps | — | 1999-11-02 |
| 5977618 | Semiconductor connection components and methods with releasable lead support | Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew | 1999-11-02 |
| 5966592 | Structure and method for making a compliant lead for a microelectronic device | Masud Beroz, Konstantine Karavakis | 1999-10-12 |
| 5959354 | Connection components with rows of lead bond sections | John W. Smith | 1999-09-28 |
| 5950304 | Methods of making semiconductor chip assemblies | Igor Y. Khandros | 1999-09-14 |
| 5937276 | Bonding lead structure with enhanced encapsulation | — | 1999-08-10 |
| 5934914 | Microelectronic contacts with asperities and methods of making same | Joseph Fjelstad, John W. Smith, James Zaccardi, A. Christian Walton | 1999-08-10 |
| 5932254 | System for encapsulating microelectronic devices | Craig Mitchell | 1999-08-03 |
| 5929517 | Compliant integrated circuit package and method of fabricating the same | Konstantine Karavakis, Craig Mitchell, John W. Smith | 1999-07-27 |
| 5915752 | Method of making connections to a semiconductor chip assembly | Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, Jason Sweis, Laurie Union +1 more | 1999-06-29 |
| 5913109 | Fixtures and methods for lead bonding and deformation | John W. Smith, Anthony B. Faraci | 1999-06-15 |
| 5885849 | Methods of making microelectronic assemblies | Vernon Solberg | 1999-03-23 |
| 5875545 | Method of mounting a connection component on a semiconductor chip with adhesives | Gus Karavakis, Zlata Kovac, Craig Mitchell | 1999-03-02 |
| 5868301 | Semiconductor inner lead bonding tool | Flynn Carson | 1999-02-09 |
| 5859472 | Curved lead configurations | John W. Smith | 1999-01-12 |
| 5852326 | Face-up semiconductor chip assembly | Igor Y. Khandros | 1998-12-22 |