Issued Patents All Time
Showing 126–150 of 184 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5848467 | Methods of making semiconductor chip assemblies | Igor Y. Khandros | 1998-12-15 |
| 5834339 | Methods for providing void-free layers for semiconductor assemblies | Joseph Fjelstad | 1998-11-10 |
| 5830782 | Microelectronic element bonding with deformation of leads in rows | John W. Smith | 1998-11-03 |
| 5821609 | Semiconductor connection component with frangible lead sections | John W. Smith, Konstantine Karavakis, Joseph Fjelstad | 1998-10-13 |
| 5821608 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Joseph Fjelstad, John W. Smith | 1998-10-13 |
| 5810609 | Socket for engaging bump leads on a microelectronic device and methods therefor | Anthony B. Faraci, James Zaccardi, John W. Smith | 1998-09-22 |
| 5812378 | Microelectronic connector for engaging bump leads | Joseph Fjelstad, John W. Smith, A. Christian Walton | 1998-09-22 |
| 5802699 | Methods of assembling microelectronic assembly with socket for engaging bump leads | Joseph Fjelstad, John W. Smith, A. Christian Walton | 1998-09-08 |
| 5801446 | Microelectronic connections with solid core joining units | Vernon Solberg | 1998-09-01 |
| 5801441 | Microelectronic mounting with multiple lead deformation and bonding | John W. Smith | 1998-09-01 |
| 5798286 | Connecting multiple microelectronic elements with lead deformation | Tony Faraci, John W. Smith | 1998-08-25 |
| 5794330 | Microelectronics unit mounting with multiple lead bonding | John W. Smith | 1998-08-18 |
| 5787581 | Methods of making semiconductor connection components with releasable load support | Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew | 1998-08-04 |
| 5776796 | Method of encapsulating a semiconductor package | John W. Smith, Joseph Fjelstad, Craig Mitchell, Konstantine Karavakis | 1998-07-07 |
| 5766987 | Microelectronic encapsulation methods and equipment | Craig Mitchell | 1998-06-16 |
| 5706174 | Compliant microelectrionic mounting device | John W. Smith, Zlata Kovac, Konstantine Karavakis | 1998-01-06 |
| 5688716 | Fan-out semiconductor chip assembly | John W. Smith, Tony Faraci | 1997-11-18 |
| 5685885 | Wafer-scale techniques for fabrication of semiconductor chip assemblies | Igor Y. Khandros | 1997-11-11 |
| 5682061 | Component for connecting a semiconductor chip to a substrate | Igor Y. Khandros | 1997-10-28 |
| 5679977 | Semiconductor chip assemblies, methods of making same and components for same | Igor Y. Khandros | 1997-10-21 |
| 5663106 | Method of encapsulating die and chip carrier | Konstantine Karavakis, John W. Smith, Craig Mitchell | 1997-09-02 |
| 5659952 | Method of fabricating compliant interface for semiconductor chip | Zlata Kovac, Craig Mitchell, John W. Smith | 1997-08-26 |
| 5650914 | Compliant thermal connectors, methods of making the same and assemblies incorporating the same | John W. Smith | 1997-07-22 |
| 5640761 | Method of making multi-layer circuit | Igor Y. Khandros, Gary W. Grube | 1997-06-24 |
| 5632631 | Microelectronic contacts with asperities and methods of making same | Joseph Fjelstad, John W. Smith, James Zaccardi, A. Christian Walton | 1997-05-27 |