Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11229126 | System and method for manufacturing flexible laminated circuit boards | Gary N. Sortino | 2022-01-18 |
| 10638615 | System and method for manufacturing flexible laminated circuit boards | Gary N. Sortino | 2020-04-28 |
| 9282651 | System for manufacturing laminated circuit boards | Gary N. Sortino | 2016-03-08 |
| 8831918 | System for manufacturing laminated circuit boards | Gary N. Sortino | 2014-09-09 |
| 8594983 | System for manufacturing laminated circuit boards | Gary N. Sortino | 2013-11-26 |
| 8065121 | Method for pin-less registration of a plurality of laminate elements | Gary N. Sortino | 2011-11-22 |
| 7491069 | Self-cleaning socket for microelectronic devices | Thomas H. Di Stefano, Konstantine Karavakis, Peter T. Di Stefano | 2009-02-17 |
| 6541845 | Components with releasable leads and methods of making releasable leads | Masud Beroz, Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba | 2003-04-01 |
| 6428328 | Method of making a connection to a microelectronic element | Belgacem Haba | 2002-08-06 |
| 6374487 | Method of making a connection to a microelectronic element | Belgacem Haba | 2002-04-23 |
| 6286205 | Method for making connections to a microelectronic device having bump leads | James Zaccardi, Thomas H. DiStefano, John W. Smith | 2001-09-11 |
| 6261863 | Components with releasable leads and methods of making releasable leads | Masud Beroz, Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba | 2001-07-17 |
| 6202297 | Socket for engaging bump leads on a microelectronic device and methods therefor | James Zaccardi, Thomas H. DiStefano, John W. Smith | 2001-03-20 |
| 6200143 | Low insertion force connector for microelectronic elements | Belgacem Haba | 2001-03-13 |
| 6086386 | Flexible connectors for microelectronic elements | Joseph Fjelstad, Thomas H. DiStefano, Konstantine Karavakis, Tan Nguyen | 2000-07-11 |
| 6080603 | Fixtures and methods for lead bonding and deformation | Thomas H. DiStefano, John W. Smith | 2000-06-27 |
| 5913109 | Fixtures and methods for lead bonding and deformation | Thomas H. DiStefano, John W. Smith | 1999-06-15 |
| 5810609 | Socket for engaging bump leads on a microelectronic device and methods therefor | James Zaccardi, Thomas H. DiStefano, John W. Smith | 1998-09-22 |
| 5144586 | Apparatus and method for connecting electronic modules containing integrated circuits and backup batteries | — | 1992-09-01 |
| 4985870 | Apparatus for connecting electronic modules containing integrated circuits and backup batteries | — | 1991-01-15 |