Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7939928 | Method and apparatus for stacked die package with insulated wire bonds | — | 2011-05-10 |
| 7718471 | Method and apparatus for stacked die package with insulated wire bonds | — | 2010-05-18 |
| 6938338 | Method of making an electronic contact | Joseph Fjelstad, John W. Smith, Thomas H. DiStefano, A. Christian Walton | 2005-09-06 |
| 6286205 | Method for making connections to a microelectronic device having bump leads | Anthony B. Faraci, Thomas H. DiStefano, John W. Smith | 2001-09-11 |
| 6205660 | Method of making an electronic contact | Joseph Fjelstad, John W. Smith, Thomas H. DiStefano, A. Christian Walton | 2001-03-27 |
| 6202297 | Socket for engaging bump leads on a microelectronic device and methods therefor | Anthony B. Faraci, Thomas H. DiStefano, John W. Smith | 2001-03-20 |
| 5934914 | Microelectronic contacts with asperities and methods of making same | Joseph Fjelstad, John W. Smith, Thomas H. DiStefano, A. Christian Walton | 1999-08-10 |
| 5810609 | Socket for engaging bump leads on a microelectronic device and methods therefor | Anthony B. Faraci, Thomas H. DiStefano, John W. Smith | 1998-09-22 |
| 5632631 | Microelectronic contacts with asperities and methods of making same | Joseph Fjelstad, John W. Smith, Thomas H. DiStefano, A. Christian Walton | 1997-05-27 |