Issued Patents All Time
Showing 151–175 of 184 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5629239 | Manufacture of semiconductor connection components with frangible lead sections | John W. Smith, Konstantine Karavakis, Joseph Fjelstad | 1997-05-13 |
| 5619017 | Microelectronic bonding with lead motion | Zlata Kovac, John Grange | 1997-04-08 |
| 5615824 | Soldering with resilient contacts | Joseph Fjelstad, John W. Smith | 1997-04-01 |
| 5597470 | Method for making a flexible lead for a microelectronic device | Konstantine Karavakis, Joseph Fjelstad | 1997-01-28 |
| 5590460 | Method of making multilayer circuit | John W. Smith, Konstantine Karavakis, Zlata Kovac, Joseph Fjelstad | 1997-01-07 |
| 5583321 | Multi-layer circuit construction methods and structures with customization features and components for use therein | Igor Y. Khandros, Gary W. Grube | 1996-12-10 |
| 5570504 | Multi-Layer circuit construction method and structure | Igor Y. Khandros, Gary W. Grube | 1996-11-05 |
| 5558928 | Multi-layer circuit structures, methods of making same and components for use therein | Scott G. Ehrenberg, Igor Y. Khandros | 1996-09-24 |
| 5557501 | Compliant thermal connectors and assemblies incorporating the same | John W. Smith | 1996-09-17 |
| 5548091 | Semiconductor chip connection components with adhesives and methods for bonding to the chip | Gus Karavakis, Zlata Kovac, Craig Mitchell | 1996-08-20 |
| 5536909 | Semiconductor connection components and methods with releasable lead support | Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew | 1996-07-16 |
| 5518964 | Microelectronic mounting with multiple lead deformation and bonding | John W. Smith | 1996-05-21 |
| 5491302 | Microelectronic bonding with lead motion | Zlata Kovac, John Grange | 1996-02-13 |
| 5489749 | Semiconductor connection components and method with releasable lead support | Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew | 1996-02-06 |
| 5455390 | Microelectronics unit mounting with multiple lead bonding | John W. Smith | 1995-10-03 |
| 5390844 | Semiconductor inner lead bonding tool | Igor Y. Khandros, Gaetan Mathiew, Jason Sweis, John Grange, Gary W. Grube | 1995-02-21 |
| 5367764 | Method of making a multi-layer circuit assembly | Scott G. Ehrenberg, Igor Y. Khandros | 1994-11-29 |
| 5346861 | Semiconductor chip assemblies and methods of making same | Igor Y. Khandros | 1994-09-13 |
| 5347159 | Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate | Igor Y. Khandros | 1994-09-13 |
| 5282312 | Multi-layer circuit construction methods with customization features | Igor Y. Khandros, Gary W. Grube | 1994-02-01 |
| 5258330 | Semiconductor chip assemblies with fan-in leads | Igor Y. Khandros | 1993-11-02 |
| 5148265 | Semiconductor chip assemblies with fan-in leads | Igor Y. Khandros | 1992-09-15 |
| 5148266 | Semiconductor chip assemblies having interposer and flexible lead | Igor Y. Khandros | 1992-09-15 |
| 4970106 | Thin film multilayer laminate interconnection board | Scott G. Ehrenberg | 1990-11-13 |
| 4933045 | Thin film multilayer laminate interconnection board assembly method | Scott G. Ehrenberg | 1990-06-12 |