Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7166914 | Semiconductor package with heat sink | Thomas H. DiStefano, John W. Smith | 2007-01-23 |
| 6365436 | Connecting multiple microelectronic elements with lead deformation | Thomas H. DiStefano, John W. Smith | 2002-04-02 |
| 6265765 | Fan-out semiconductor chip assembly | Thomas H. DiStefano, John W. Smith | 2001-07-24 |
| 6147400 | Connecting multiple microelectronic elements with lead deformation | Thomas H. DiStefano, John W. Smith | 2000-11-14 |
| 5798286 | Connecting multiple microelectronic elements with lead deformation | Thomas H. DiStefano, John W. Smith | 1998-08-25 |
| 5688716 | Fan-out semiconductor chip assembly | Thomas H. DiStefano, John W. Smith | 1997-11-18 |